The silicon carbide wafer grinding and polishing industry is currently at a crucial stage of rapid development in the third-generation semiconductor industry. Due to the extremely high hardness of silicon carbide materials and the difficulty of processing, the requirements for the precision and stability of the grinding and polishing processes are extremely stringent.
As core consumables, products such as grinding wheels, polishing pads, and polishing fluids face challenges such as high technical thresholds and complex international certification requirements in the industry.









