Silicon dioxide polishing slurry
Highly selective polishing, with excellent planarization effect
Ultra-low defect rate, high surface cleanliness
The colloid has good stability and a wide process window
Product Features
Excellent global planarization capability
Through the synergistic effect of chemical etching and mechanical grinding, high-selectivity polishing at the nanoscale is achieved, eliminating the micro-height differences on the wafer surface.
Achieve a perfect surface with ultra-low defects
Spherical and monodisperse nanoscale silica sol particles have moderate hardness, which can gently remove materials and greatly reduce surface scratches and residues during polishing, meeting the stringent requirements of the semiconductor industry for ultra-low defect rates.
Extremely wide process adaptability and stability
The product exhibits excellent chemical and mechanical stability, with adjustable pH value and concentration, allowing for flexible adaptation to different CMP process parameters of customers. The colloidal system remains stable even after long-term storage, without stratification or gelation.
Product Parameters
Relevant cases
Quality Assurance
We are committed to providing you with stable performance and pure polishing products through comprehensive quality control, ensuring efficient and high-yield production for you.
We achieve this through our unparalleled customer service,
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