Damping cloth polishing pad
It has a cushioning effect, reducing surface damage
The polishing pressure is evenly distributed
Good stability, enhancing processing consistency
Product Features
Excellent buffering performance
The damping layer effectively disperses pressure and reduces the risk of surface scratching, making it particularly suitable for polishing high-value precision materials.
Strong stability
Maintain stable performance during repeated processing, resist deformation, and ensure process controllability.
Suitable for fine craftsmanship
It is particularly suitable for applications where high surface quality is required.
The pressure distribution is uniform
It can evenly apply pressure on the surface of large-area workpieces, reducing issues of local over-polishing or under-polishing, and enhancing the overall surface finish.
Product Parameters
Relevant cases
Quality Assurance
Each finished polishing pad undergoes comprehensive inspection across multiple dimensions, including thickness, hardness, and porosity, to ensure uniform and stable microstructure, providing customers with consistent polishing performance.
Among polishing pads of the same type, this product exhibits significant advantages in terms of removal rate stability and defect control (scratching, pitting), effectively meeting the semiconductor production line's ultimate pursuit of high yield and process window.
We achieve this through our unparalleled customer service,
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