## This Week's Semiconductor Industry News ##
① KIOXIA and NVIDIA jointly develop ultra-fast AI SSD, with a 100-fold increase in read speed
Kioxia recently announced its collaboration with NVIDIA to develop a new type of solid-state drive (SSD) specifically designed for generative artificial intelligence (AI) computing servers, with commercial availability expected by 2027.
② GIGABYTE collaborates with V-COLOR to launch innovative built-in OLED overclocking memory
September 2025, Taipei, Taiwan - To revolutionize the memory experience for overclocking enthusiasts and high-performance users, v-color (V-Color Technology Co., Ltd.), a global leader in memory innovation, officially unveiled the world's first DDR5 memory module with built-in OLED - XFinity+. This innovative product made its debut at the 2025 Taipei International Computer Show (COMPUTEX), highlighting significant breakthroughs in performance visualization, system diagnostics, and personalization.
③ Daheng Technology: Plans to invest 600 million yuan to establish a semiconductor subsidiary in Shanghai
Recently, Daheng Technology announced its intention to invest 600 million yuan of its own funds to establish a wholly-owned subsidiary in Shanghai, named Shanghai Xinheng Xinrui Technology Co., Ltd. This subsidiary will primarily engage in semiconductor-related auxiliary equipment business.
④ Peng'an Semiconductor: TS-PON Gen2 chip is reshaping the underlying communication architecture of smart cars and robots
In today's era of rapid digitalization and intelligence, the communication technology between smart cars and robots is facing unprecedented challenges and opportunities. On September 10th, the editor of Global Semiconductor Insights conducted an interview with Dr. Zhang Lu, co-founder and COO of Penguan Semiconductor, to gain a deeper understanding of the company's latest achievement in the field of in-vehicle optical communication - TS-PON Gen2 chip, as well as its plans for future technological development.
⑤ Intel completes the sale of its Altera stake
On September 12, 2025, semiconductor giant Intel announced that it had completed the sale of a 51% majority stake in its programmable chip business Altera to private equity firm Silver Lake for a transaction amount of approximately $3.3 billion.
⑥ Amlogic plans to acquire 100% of the equity of Chipmax for RMB 316 million, laying the groundwork for its wireless communication chip business
On the evening of September 15th, Amlogic announced its intention to acquire 100% of the equity of Xinxinmai Microelectronics (Jiaxing) Co., Ltd. (hereinafter referred to as "Xinxinmai") in cash, with a total acquisition consideration of RMB 316 million.
⑦ ProRun Technologies plans to acquire SHM, a high-performance 2D NAND memory chip company
On September 15th, Puran Stock announced its intention to acquire a controlling stake in Zhuhai Nuoyachangtian Storage Technology Co., Ltd., a company in which it holds a participating interest, through a cash transaction. The counterparties to the transaction are Zhuhai Nuoyan, Yuanhe Puhua, and Hengqin Qiangke. After the transaction, Puran Stock will indirectly hold 100% of the shares of SkyHigh Memory Limited (SHM), a Hong Kong semiconductor company in which Nuoyachangtian holds a 100% stake, and will consolidate both companies into its consolidated financial statements.
⑧ MediaTek and TSMC jointly launch 2nm SoC, with mass production scheduled for the end of 2026
MediaTek announced on September 16, 2025, that its first flagship System-on-Chip (SoC) utilizing TSMC's 2nm process technology has successfully completed design finalization (tape out), making it one of the first companies to adopt this technology. This chip is expected to enter the market by the end of 2026 and commence mass production by the end of the following year.
⑨ Opportunities and challenges of 2nm advanced process chips
Recently, Japanese chip manufacturer Rapidus published an article on its official website titled "The 2nm Semiconductor Challenge: Exploring Rapidus' Technological Breakthroughs", introducing the necessity of 2nm chips in the AI era and Rapidus' corresponding layout.
⑩ NVIDIA attempts to upgrade HBM4 specifications, expecting SK Hynix to remain the largest supplier in 2026
According to the latest survey by TrendForce, in anticipation of AMD's launch of the MI450 Helios platform in 2026, NVIDIA has recently actively requested key component suppliers for the Vera Rubin server rack to enhance product specifications, including increasing the Speed per Pin of HBM4 to 10Gbps.
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① https://www.dramx.com/News/Memory/20250912-39091.html
② https://www.dramx.com/News/Memory/20250912-39083.html
③ https://www.dramx.com/News/cailiao-shebei/20250915-39094.html
④ https://www.dramx.com/News/ict/20250915-39097.html
⑤ https://www.dramx.com/News/AI/20250916-39099.html
⑥ https://www.dramx.com/News/IC/20250916-39100.html
⑦ https://www.dramx.cohttps://www.dramx.com/News/Memory/20250916-39102.html
⑧ https://www.dramx.com/News/made-sealing/20250916-39105.html
⑨ https://www.dramx.com/News/made-sealing/20250916-39106.html
⑩ https://www.dramx.com/Market/20250918-39122.html
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